• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    general automotive pressure sensor. the present invention relates to a general pressure sensor for an automobile comprising a sensor housing, a sensitive silicon piezoresistive core, a sensor core base, a signal conditioning circuit, and an automobile electrical device interface. the piezoresistive silicon sensitive core, the sensor core base and the signal conditioning circuit are arranged in the internal cavity of the sensor housing. the sensor housing is installed to an automotive electrical device interface, and the piezoresistive silicon sensitive core comprises a piezoresistive silicon sensitive element and a sheet of glass ring. the sensitive piezoresistive silicon element is welded and fixed to the surface of the glass ring sheet. an insulating oxidation layer is formed on a surface of the glass ring sheet and the sensitive silicon piezoresistive element. the other surface of the glass ring sheet is hermetically fixed to the ring-shaped recess surface provided on the base of the sensor core. the base of the sensor core is hermetically and rotationally fixed to the pressure inlet in the sensor housing, after the internal lead wire in the piezoresistive silicon sensitive core is taken to an interposition plate provided at one end of the central hole through the other end of the central orifice in the ring-shaped recess surface of the sensor core base, and then it is carried out by the automobile fixture interface via the signal conditioning circuit.
    公开号:BR112012030407B1
    申请号:R112012030407-0
    申请日:2011-01-14
    公开日:2020-03-31
    发明作者:Wenxiang Wang；Bing Wang；Chaomin Mao；Qiao Shi；Wei Li；Chao Wang
    申请人:Shanghai Wenxiang Automotive Sensors Co., Ltd.；Kunshan Shuangqiao Sensor Measurement Controlling Co., Ltd.；Wenxiang Wang；
    IPC主号:
    专利说明:

    Descriptive Report of the Invention Patent for GENERAL PRESSURE SENSOR FOR AUTOMOBILE.
    Field of the Invention
    The present invention relates to a general pressure sensor for an automobile, more particularly, it relates to a general pressure sensor for an automobile based on MEMS technology based on silicone, the sensor can be used for pressure measurement for medium such as oil pressure, gas pressure, fuel, coolant, liquid pressure and the like in various automobiles and their vehicle systems.
    Background
    As one of the sources of information for an automotive electronic control system, the general purpose pressure sensor for an automobile is a fundamental part of the automotive electronic control system, and is also one of the core contents of research in the technical field of electronics. automotive. General pressure sensors for an automobile are mainly used for the control of pressure measurement of parts such as brake systems, automatic transmission, air conditioning systems, suspension systems, engine oil pressure, power transmission systems switching, direct engine injection pressure, LPG and CNG systems and the like in automobiles.
    In the 1980s, traditional automotive high pressure sensors used thick film ceramic technique, with the development of many years, the cost of manufacturing ceramic core has been significantly reduced in these days the price meets the needs of automotive application. However, due to their high fragility, ceramic materials are poor in resistance to liquid pressure impact overload (usually with an overload capacity of only 1.5 ~ 2 times of static pressure), and poor in resistance to vibration, low reliability and low output sensitivity (2 mV / V), so it is faced with elimination in the sense that it may not meet the necessary development of pressure measurement in automobiles.
    In the 1990s, high pressure auto sensors appeared
    2/11 using tension technology, the low cost for core fabrication property still remained, but solved the problem of poor vibration resistance of thick film ceramics and improved the ability to withstand pressure impact overload at the same time . However, since the structural principle of the sensor used metal stress adhesive technology, the fatigue of the organic adhesive resulted in a shorter lifetime of the sensor as a whole, and degraded measurement accuracy with time of use due to of adhesive curling, and in the meantime, the sensitivity output was still very low.
    Recently, Measurement Specialties Inc. of America and Sensata of America made improvements to the stress technology described above by replacing the stress adhesive gauge technology with the high temperature glass powder sintered silicon transducer technology, despite the relative increase in the cost of manufacturing the core, solved the problem of lifetime and measurement accuracy of the sensor that varies with time, and the use of a silicon voltage transducer significantly increases the sensitivity output at the same time. However, in the sintering process of powdered glass, the area is relatively large due to the thin thickness of the powdered glass layer, for a glass material that is relatively fragile when subjected to a rapid impact of pressure overload and temperature impact, rupture will occur in the sintered glass layer, and its resistance to the impact of pressure overload in general still remains only twice, and the operating temperature range is only -20 ~ 80 ° C, so it may not meet the operational needs of the car level in many ways. Also, in a last stage, the disadvantage of the voltage mode described above is solved by a pressure sensor in general by thin film sputtering which is derived from the voltage mode, the operating temperature region can also go from meets the needs of the car level, and the sensitivity output can reach 5 mV / V and the impact pressure resistance overloads twice. However, due to its relatively high manufacturing cost,
    3/11 will not be popularized in automotive application over a wide range.
    Companies such as KELLER of Europe and Honeywell of America use MEMS sensitive element of monocrystalline silicon, the sensitivity output can be up to 20 mV / V and the impact pressure resistance overloads 3 times, on the premise of satisfying the application of the level of automotive, although relative batch manufacturing of sensitive elements at low cost is achieved by using a semiconductor MEMS process, due to the overall international design of the general monocrystalline silicon pressure sensor chip it is a structure where the rear surface supports the chip and the front surface withstands pressure, among them a complex welding technique with oil-filled insulation is necessary to meet the compatibility needs of the measurement medium, so the cost of manufacturing the products is significantly increased, and therefore may not be popularized in automotive applications over a wide range.
    Summary of the Invention
    To solve the problems described above, an aspect of the present invention provides a general pressure sensor for an automobile having the properties of high measurement accuracy and low cost, which can meet the needs of pressure measurement such as oil pressure, gas pressure, fuel, coolant, liquid pressure etc., and installation is convenient and reliable.
    The technical solution of the aspect of the present invention is achieved as follows: a general pressure sensor for an automobile comprises a sensor housing, a sensitive silicon piezoresistive core, a sensor core base, a signal conditioning circuit and an interface automobile electrical device, and the sensitive piezoresistive silicon core, the sensor core base and the signal conditioning circuit are arranged in the internal cavity of the sensor housing, and the sensor housing is installed in the interface of the electrical device car.
    The sensitive piezoresistive silicon core comprises an
    4/11 sensitive piezoresistive silicon ment and a sheet of glass ring. The sensitive piezoresistive silicon element comprises a sheet of silicon film which is covered with a layer of silicon oxide and a layer of silicon nitride in turn. The middle part of the front surface of the sensitive silicon piezoresistive element is provided with a Wheatstone bridge, while after the sheet of silicon film is exposed in the surrounding part of the front surface, the sensitive silicon piezoresistive element is solidly welded to a surface of the glass ring sheet whose thermal expansion coefficient is similar to silicon. The voltage resistance on the Wheatstone bridge is carried out by means of an internal welded lead wire. An insulating oxidation layer is formed on the front surface of the sensitive piezoresistive silicon element and the glass ring sheet.
    The other surface of the glass ring sheet is hermetically fixed to a recess surface in the form of a ring which is provided on the base of the sensor core. The sensor core base is hermetically and rotationally fixed to the pressure inlet in the sensor housing. The internal lead wire in the sensitive piezoresistive silicon core is taken to an interposition plate provided at one end of the central hole via the other end of the central hole in the ring-shaped recess surface of the sensor core base, and then the internal lead wire in the sensitive piezoresistive silicon core is carried out by an automobile fixture interface via the signal conditioning circuit.
    The sensor housing comprises a sensor base and a sensor shield that is rotationally attached to the sensor base and then forms an internal cavity. The sensor shield is installed in the automotive electrical device interface, and the middle part of the sensor base has a stepped hole that acts as the pressure inlet, and the sensor core base is rotationally fixed to the stepped hole in the sensor base by means of thread sealant.
    As a further enhancement to the present invention, its
    5/11 circumferential surface of the stepped orifice has a ring-type recession, and the ring-type recession is caused by an O-shaped seal ring, while the sensor core base is rotationally fixed to the stepped orifice of the sensor base , the sensor core base presses tightly on the O-shaped seal ring, thus a hermetic fixation between the sensor core chassis and the sensor base is achieved.
    As a further enhancement of the present invention, the signal conditioning circuit board provided with the signal conditioning circuit is fixed to the internal cavity of the sensor housing, and the signal conditioning circuit comprises a signal amplification circuit, a large-scale, zero-position output conditioning circuit, a temperature sensitivity coefficient and zero-position compensation circuit, and a non-linear trimming circuit.
    As a further enhancement of the present invention, the pressure measurement range corresponding to the sensor is 0 ~ 0.5 MPa to 0 ~ 100 MPa, and the diameter and thickness of the rounded flat sheet of silicon film is 2 mm ~ 4 mm and 0.22 ~ 0.91 mm, respectively.
    As a further enhancement of the present invention, the inner wall of the glass ring sheet and the inner wall of the central hole in the sensor core base are provided with an adhesive silicone rubber as an insulating surface.
    As a further enhancement of the present invention, the sensor shield is rotationally attached to an automobile fixture interface by means of a seal, a ring-type connection seam between the sensor core base and the sensor base, and a seam of ring-type connections between the sensor shield and the sensor base are hermetically welded using a laser or electron beam.
    As a further enhancement of the present invention, the sensor core base, the sensor base and the sensor housing are made of stainless steel material.
    6/11
    As a further enhancement of the present invention, Pyrex 7740 or GG-17 glass ring foil is employed for the glass ring foil.
    A beneficial technical effect of the present invention is that the Wheatstone bridge is provided on the front surface of the sensitive silicon piezoresistive element, while the rear surface acts as a pressure-bearing surface, doing so, the pressure from the external medium is brought in. through the pressure inlet and the rear surface of the sensitive piezoresistive silicon element withstands pressure, so the impact from the external environment is reduced.
    Also, the piezoresistive silicon sensitive element is hermetically fixed to the sensor core base through the glass ring sheet, while the sensor core base is in turn hermetically fixed to the inside of the pressure housing of the sensor housing, while The sensor housing is made up of a sensor base and a sensor shield that is rotationally attached to the sensor base and then forms an internal cavity, the sensor shield is installed at an automotive electrical device interface, and there is a stepped hole as the entrance pressure in the middle part of the sensor base, and the sensor core base is rotationally fixed to the stepped hole in the sensor base by means of the thread sealant, in doing so, the sealing property between the glass ring sheet, the base sensor core, the sensor base and the sensor shield are guaranteed while the sensor is manufactured by means of a plurality of measures, thus the reliability of the measurement will is guaranteed.
    In addition, an insulating oxidation layer is formed on the front surface of the glass ring sheet and on the sensitive piezoresistive silicon element, thus measuring accuracy is improved, and signal amplification, zero positioning and large-scale output conditioning, Zero positioning and compensation of the temperature sensitivity coefficient and non-linear trimming are carried out when introducing the signal conditioning circuit, so it completely meets the needs of automotive high pressure measurement.
    7/11
    Brief Description of Drawings
    In order to achieve the objectives, characteristics and advantages mentioned above of the present invention more apparently and readily to appreciate, a detailed description of the modalities of the present invention will be given together with the accompanying drawings in which:
    Figure 1 is a schematic view of the structure of the piezoresistive silicon sensitive element of an embodiment of the present invention;
    Figure 2 is a schematic view of the structure of the sensitive silicon piezoresistive core of an embodiment of the present invention;
    Figure 3 is a schematic view of the silicon piezoresistive sensitive core assembly and sensor core base of an embodiment of the present invention;
    Figure 4 is a schematic view of the structure of the sensor core and sensor base when assembled in an embodiment of the present invention;
    Figure 5 is a schematic view of the structure of the general automotive pressure sensor of an embodiment of the present invention.
    Reference listing
    - piezoresistive silicon sensitive element
    - round and flat silicon film sheet
    - S1O2 layer
    - SYNN4 layer
    - resistance to tension
    - internal lead wire spun in gold
    - glass ring sheet
    - sensor core base
    - interposition plate
    - sensor base
    - O-ring seal
    - sensor shield
    - automobile fixture interface
    - core cable wire leading out
    11/11
    91, 92 - ring-shaped connection seam
    - thread sealant
    101 - signal conditioning circuit board
    DETAILED DESCRIPTION
    A further description of the modalities of the present invention will be given in conjunction with figures 1, 2, 3, 4, and 5 respectively in the following.
    A general automotive pressure sensor comprises a sensor housing, a sensitive piezoresistive silicon core, a sensor core base, a signal conditioning circuit and an automotive fixture interface. The piezoresistive silicon sensitive core, the sensor core base and the signal conditioning circuit are arranged in the internal cavity of the sensor housing. The sensor housing is installed to an automobile electrical device interface, and the signal conditioning circuit board 101 provided with the signal conditioning circuit is attached to the internal cavity of the sensor.
    As shown in figure 1 and figure 2, the piezoresistive silicon core is composed of the piezoresistive sensitive element 1 and the glass ring sheet 2. The piezoresistive sensitive element 1 includes a flat, rounded silicon film 11 the front surface of the which, in turn, is covered with a layer of silicon oxide (S1O2) 12 and a layer of silicon nitride (SÍNN4) 13. The middle part of the front surface of the sensitive silicon piezoresistive element 1 (ie, the the surface of the silicon nitride layer 13) is provided with the Wheatstone bridge, whereas after the sheet of silicon film is exposed on the surrounding part of the front surface, the sensitive piezoresistive element 1 is solidly welded to a sheet of glass ring 2 of which the coefficient of thermal expansion is similar to silicon. The tensile strength 14 on the Wheatstone bridge is carried out by means of the welded gold lead internal wire 15, the rear surface is subjected to pressure, and thus the influence of the external environment is reduced. Low temperature semiconductor anode oxidation insulation process is implemented at the front surface of the fo
    9/11 glass ring 2 and the piezoresistive sensitive element 1 to form an insulating oxidation layer.
    As shown in figure 3, the other surface of the glass ring sheet 2 (unpolished rough surface, upper surface as seen from the angle of figure 3) is hermetically fixed to the ring-shaped recess surface provided on the core base sensor 3 using epoxy resin. the sensor core base 3 is hermetically and rotationally fixed to the pressure inlet in the sensor housing. The internal lead wire spun in gold 15 in the piezoresistive sensitive core body is brought into the interposition plate 4 from one end of the central hole provided in the base of the sensor core via the other end of the central hole in the shaped recess surface ring of the sensor core base 3, then the internal gold-spun lead wire 15 in the piezoresistive sensitive core is carried out by an automobile fixture interface 7 by means of the signal conditioning circuit. As shown in figure 5, the interposition plate 4 is adhesively bonded to the ring-type recess surface of one end of the central hole in the sensor core base 3, and is exported by connecting to the signal conditioning circuit board 101 through core cable wire leading out 8,
    As shown in figure 4 and figure 5, the sensor housing is composed of a sensor base 5 and a sensor shield 6. Sensor shield 6 is rotationally attached to the sensor base 5 and then an internal cavity is formed. In a modality, the sensor core 3, the sensor base 5 and the sensor shield are produced from stainless steel material. The sensor shield 6 is installed to an automobile electrical device interface 7. A hole stepped as the pressure inlet is provided in the middle part of the sensor base 5, and an external thread of the sensor core 3 is rotationally fixed to the internal thread groove. of the stepped orifice in the sensor base 5 by means of the thread seal 10. The circumferential surface of the stepped orifice has a recess of the type of ring provided with an O-ring seal 51. While the sensor core 3 is rotational
    10/11 finally fixed to the stepped hole in the sensor base 5, the sensor core base 3 presses tightly on the O-ring seal 51 (a fixed torque wrench can be used for screwing until it is tightly screwed and sealed) , and in this way the sealed fixation between the sensor core 3 and the sensor base 5 is achieved.
    In order to improve the reliability of the sensor, the inner wall of the glass ring sheet 2 and the inner wall of the central hole in the sensor core base 3 are provided with an adhesive silicone rubber as an insulating surface, at the same time. ring-shaped connection seam 91 between the sensor core base 3 and the sensor base 5, and the ring-shaped connection seam 92 between the sensor base 5 and the sensor shield 6 are welded and sealed when using laser or electron, thus a triple-sealing structure of multiple layers with high reliability is formed.
    The signal conditioning circuit board 101 provided with signal conditioning circuit is fixed to the internal cavity of the sensor. The signal conditioning circuit has a signal amplification circuit, a large scale, zero position output conditioning circuit, a temperature sensitivity and zero position compensation circuit, and a non-linear trimming circuit. The measuring range corresponding to the sensor is 0 ~ 0.5 MPa to 0 ~ 100MPa, and the diameter and thickness of the silicon film sheet 11 is 2mm ~ 4mm, and 0.22 ~ 0.91 mm, respectively.
    In order to improve the measurement accuracy of the sensor, the sealing property of the structure is especially important, and the sensor shield 6 is rotationally fixed to an automobile fixture interface 7 by means of a seal. The ring-type connection seam 91 between the sensor core base 3 and the sensor base 5, and the ring-type connection seam 92 between the sensor shield 6 and the sensor base 5 are hermetically welded by means of laser or electron, so a multi-layered sealing structure with high reliability is formed.
    In a modality, the glass ring foil 2 employs foil
    11/11 Pyrex 7740 or GG-17 glass ring, the Pyrex glass ring is a product offered by Corning Inc., it is specifically designed for semiconductor packaging, and has a physical property close to that of silicon, The substitute produced in China is GG-17 borosilicate glass. A part of the Wheatstone bridge of the sensitive piezoresistive silicon element is produced by employing the technical solution described in the Chinese Patent which is entitled A mini dynamic piezoresistive general pressure sensor and a manufacturing method thereof (Patent No. ZL200310106329.8).
    A general pressure sensor for an automobile with low cost, high precision, high reliability and long service life is created by combining the integrated circuit technique of semiconductor plane, MEMS technique and digital intelligent circuit technique in the modality described above.
    A pressure sensor for an automobile based on the pres technique, the performance indices of which are:
    1) pressure measurement range: 0 ~ 0.5 to 0 ~ 100 MPa;
    2) power supply and signal: power supply 5V DC ± 0.5, signal is output in any relationship between 0 ~ 5V;
    3) operating temperature region: —40 ~ 125 ° C (for long term), —55 ~ 135 ° C (for four hours);
    4) accuracy level: integrated error of the total temperature operating region A is better than 1% FS, and integrated error of the total temperature operating region B is better than 0.5% FS;
    5) resistance capacity of impact overload: greater than 600% FS;
    6) service life: 10 7 times of pressure cycles;
    7) annual stability: 0.25% FS.
    Although the present invention has been described with the preferred modalities above, they are not intended to limit the scope of the present invention, and those skilled in the art can make minor modifications and improvements without departing from the spirit and scope of the present invention, thus the scope of protection of the present invention should be defined by the appended claims.
    权利要求:
    Claims (14)
    [1]
    1. A general automotive pressure sensor comprising a sensor housing, a piezoresistive silicon sensitive core, a sensor core base (3), a signal conditioning circuit and an automotive fixture interface (7), and the piezoresistive sensitive silicon core, the sensor core base (3) and the signal conditioning circuit are arranged in the internal cavity of the sensor housing, and the sensor housing is installed to an interface of the automobile's electrical device (7) characterized by the fact that:
    the sensitive piezoresistive silicon core comprises a sensitive piezoresistive silicon element (1) and a glass ring sheet (2), the sensitive piezoresistive silicon element (1) comprises a sheet of silicon film which is, in turn, covered with a layer of silicon oxide (12) and a layer of silicon nitride (13) on its front surface, the middle part of the front surface of the sensitive silicon piezoresistive element (1) is provided with the Wheatstone bridge, while after the sheet of silicon film is exposed in the surrounding part, the sensitive silicon piezoresistive element (1) is welded and fixed to a surface of the glass ring sheet (2) with a thermal expansion coefficient similar to silicon, a resistance the tension (14) on the Wheatstone bridge is carried out by means of an internal lead wire, and an oxidation insulating layer is formed on a surface of the glass ring sheet (2) and the piezoresistive silicon sensitive element (1);
    the other surface of the silicon ring sheet is hermetically fixed to the ring-shaped recess surface provided on the sensor core base (3), the sensor core base (3) is hermetically and rotationally fixed to the pressure inlet in the housing sensor, the internal lead wire in the sensitive piezoresistive silicon core is attached to an interposition plate (4) provided at one end of the central hole through the other end of the central hole in the ring-shaped recess surface of the core base sensor (3), and then the internal lead wire is in turn taken out through the conditioning circuit Petition 870190101125, of 10/9/2019, p. 6/12
    [2]
    2/4 signal input per car electrical device interface (7);
    The sensor housing comprises a sensor base (5) and a sensor shield (6) which are rotationally attached to the sensor base (5) and then form the internal cavity, the sensor shield is installed to an automobile electrical device interface (7 ), the middle part of the sensor base (5) has a stepped hole as a pressure inlet, and the sensor core base (3) is rotationally fixed to the stepped hole in the sensor base (5) by means of thread sealant (10 ).
    2. General pressure sensor for an automobile, according to claim 1, characterized by the fact that on the circumferential surface of the stepped orifice there is a recession of the ring type, the recession of the ring type is caused by a sealing ring in O-shape (51), while the sensor core base (3) is rotationally fixed to the stepped hole in the sensor base (5), the sensor core base (3) presses tightly on the O-shaped seal ring (51) .
    [3]
    3. General pressure sensor for an automobile according to claim 1, characterized by the fact that a signal conditioning circuit board (101) provided with the signal conditioning circuit is fixed to the internal cavity of the sensor housing , the signal conditioning circuit has a signal amplification circuit, a large scale, zero position output conditioning circuit, a temperature sensitivity and zero position compensation circuit, and a non-linear trimming circuit .
    [4]
    4. General pressure sensor for an automobile according to claim 2, characterized by the fact that a signal conditioning circuit board (101) provided with the signal conditioning circuit is fixed to the internal cavity of the sensor housing , the signal conditioning circuit has a signal amplification circuit, a large scale, zero position output conditioning circuit, a temperature sensitivity and zero position compensation circuit, and a non-linear trimming circuit .
    [5]
    5. General pressure sensor for a car, according to
    Petition 870190101125, of 10/09/2019, p. 7/12
    3/4 claim 1, characterized by the fact that the pressure measurement range of the sensor is 0 ~ 0.5 MPa to 0 ~ 100 MPa.
    [6]
    6. General pressure sensor for an automobile, according to claim 2, characterized by the fact that the pressure measurement range of the sensor is 0 ~ 0.5 MPa to 0 ~ 100 MPa.
    [7]
    7. General pressure sensor for an automobile, according to claim 1, characterized by the fact that the diameter and thickness of the sensor is 2 mm ~ 4 mm and 0.22 mm ~ 0.91 mm, respectively.
    [8]
    8. General pressure sensor for an automobile, according to claim 2, characterized by the fact that the diameter and thickness of the sensor is 2 mm ~ 4 mm and 0.22 mm ~ 0.91 mm, respectively.
    [9]
    9. General pressure sensor for an automobile, according to claim 1, characterized by the fact that the inner wall of the glass ring sheet (2) and the inner wall of the central hole in the sensor core base (3) are provided with an adhesive silicone rubber as an insulating surface.
    [10]
    10. General pressure sensor for an automobile, according to claim 2, characterized by the fact that the inner wall of the glass ring sheet (2) and the inner wall of the central hole in the sensor core base (3) are provided with an adhesive silicone rubber as an insulating surface.
    [11]
    11. General pressure sensor for an automobile, according to claim 1, characterized by the fact that the sensor shield (6) is rotationally fixed to an automobile electrical device interface (7) by means of a seal, and a seam connection type ring between the sensor core base (3) and the sensor base (5), a ring type connection seam between the sensor shield (6) and the sensor base (5) are hermetically welded by means of laser or electron beam.
    [12]
    12. General pressure sensor for an automobile, according to claim 2, characterized by the fact that the sensor shield (6) is rotationally fixed to an automobile electrical device interface (7) by means of a seal, and a seam connection type of ring between the base
    Petition 870190101125, of 10/09/2019, p. 12/12
    4/4 sensor core (3) and the sensor base (5), a ring-type connection seam between the sensor shield (6) and the sensor base (5) are hermetically welded by means of a laser or electron beam .
    [13]
    13. General pressure sensor for a car, according to
    5 to claim 1, characterized by the fact that the sensor core base (3), the sensor base (5) and the sensor shield (6) are produced from stainless steel material.
    [14]
    14. General pressure sensor for an automobile, according to claim 2, characterized by the fact that the sensor core base
    10 (3), the sensor base (5) and the sensor shield (6) are produced from stainless steel material.
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    同族专利:
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    法律状态:
    2019-01-08| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|
    2019-07-16| B06A| Patent application procedure suspended [chapter 6.1 patent gazette]|
    2020-02-04| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2020-03-31| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 14/01/2011, OBSERVADAS AS CONDICOES LEGAIS. |
    优先权:
    申请号 | 申请日 | 专利标题
    CN201010187894.1|2010-05-31|
    CN2010101878941A|CN102023066B|2010-05-31|2010-05-31|Universal pressure sensor of automobile|
    PCT/CN2011/070245|WO2011150691A1|2010-05-31|2011-01-14|Universal pressure sensor for automobile|
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